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YJ-9.6B10L/PA&YJ-9B5L/PA
被加工件最大厚度：20mm被加工件最大直徑：180mm
機器重量：約1980kg
本機器主要適用于硅片、石英晶片、光學晶體、玻璃、寶石、鈮酸鋰、砷化鎵、陶瓷片等薄脆金屬或非金屬的研磨或拋光。 The machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz,optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc. 查看詳情
YJ-9.6B10L/PE&YJ-9B5L/PE
被加工件最大厚度：20mm被加工件最大直徑：180mm
機器重量：約1900kg
本機器主要適用于硅片、石英晶片、光學晶體、玻璃、寶石、鈮酸鋰、砷化鎵、陶瓷片等薄脆金屬或非金屬的研磨或拋光。 The machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal quartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc. 查看詳情
YJ-13B5L/PA
被加工件最大厚度：25mm被加工件最大直徑：270mm
機器重量：約3200kg
本機器主要用于半導體材料、金屬、非金屬工件（如閥板、剛性密封墊、活塞環、寶石制品、玻璃制品等）的平面研磨。也適用于超薄、脆性材料制成工件（如石英晶體）的研磨。 This machine is suitable for lapping and polishing of semi-conductor material, metal, and non -metal parts such as valve plate, rigid seal pad, piston ring, sapphire, and glass, as well as ultra-thin and fragile parts, such as quartz crystal. 查看詳情
YJ-13B6L/PA
被加工件最大厚度：20mm被加工件最大直徑：270mm
機器重量：約2500kg
本機器主要適用于手機視窗、硅片、石英晶片、光學晶體、光學玻璃、鈮酸鋰、砷化鎵、陶瓷片等薄脆金屬或非金屬的研磨或拋光。 The machine is suitable for lapping and polishing of cell phone cover lens, silicon wafer, crystal quartz, optical crystal, optical glass, lithium niobium acid, gallium arsenide, ceramic wafer and other hard and fragile metal or non-metal materials. 查看詳情
YJ-13B6L/PD
最大工件厚度：20mm 最大工件直徑：270mm
機器重量：2850kg
本機器主要適用于手機視窗、硅片、石英晶片、光學晶體、光學玻璃、鈮酸鋰、砷化鎵、陶瓷片等薄脆金屬或非金屬的研磨或拋光。 The machine is suitable for lapping and polishing of cell phone cover lens, silicon wafer, crystal quartz, optical crystal, optical glass, lithium niobium acid, gallium arsenide, ceramic wafer and other hard and fragile metal or non-metal materials. 查看詳情
YJ-15B7L/PB
被加工件最大厚度：20mm被加工件最大直徑：280mm
機器重量：約3450kg
本機器主要用于光學玻璃、視窗玻璃、陶瓷、藍寶石等電子、光學材料的精密平面拋光；同時也適用于超薄、脆性材料制作的零件，如閥板、閥片、剛性密封墊、活塞環、石英晶體、玻璃、寶石、其它金屬、非金屬等的精密平面拋光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include optic glass, cover lens, ceramic, sapphire, silicon wafer, quartz crystal, and other hard and fragile materials. 查看詳情
YJ-15B7L/PC
被加工件最大厚度：20mm被加工件最大直徑：280mm
機器重量：約3450kg
本機器主要用于光學玻璃、視窗玻璃、陶瓷、藍寶石等電子、光學材料的精密平面拋光；同時也適用于超薄、脆性材料制作的零件，如閥板、閥片、剛性密封墊、活塞環、石英晶體、玻璃、寶石、其它金屬、非金屬等的精密平面拋光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include optic glass, cover lens, ceramic, sapphire, silicon wafer, quartz crystal, and other hard and fragile materials. 查看詳情
YJ-16B5L/PE
被加工件最大厚度：35mm被加工件最大直徑：φ380mm
機器重量：約4200kg
本機器適用于硅片、石英晶片、寶石片、光學水晶、光學玻璃、鈮酸鋰、陶瓷片、玻璃及其它硬脆材料的雙面精密研磨加工。 The machine is suitable for double-side precision lapping and polishing of silicon wafer, crystal quartz wafer, sapphire wafer, optical crystal, optical glass, lithium niobium acid, ceramic wafer, and other hard and fragile materials. 查看詳情
YJ-16B8L/PB
被加工件最大厚度：30mm被加工件最大直徑：φ290mm
機器重量：約4200Kg
本機器主要用于硅片、砷化鎵片、陶瓷片、石英晶體及其他半導體材料的雙面高精度研磨或拋光，也適用于其他金屬、非金屬、光學玻璃、藍寶石等硬、脆、薄材料的雙面高精度研磨或拋光。 This machine is suitable for double-side precision lapping and polishing of silicon wafer, crystal quartz wafer, sapphire wafer, optical crystal, optical glass, lithium niobium acid, ceramic wafer, and other hard and fragile materials. 查看詳情
YJ-20B5L/PA
被加工件最大厚度：55mm被加工件最大直徑：φ454mm
機器重量：約8800
本機器主要用于硅片、砷化鎵片、陶瓷片、石英晶體及其它半導體材料的雙面高精度研磨或拋光，也適用于其它金屬、非金屬、光學玻璃等硬、脆、薄材料的雙面高精度研磨或拋光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials. 查看詳情
YJ-22B5L/PA
被加工件最大厚度：40mm被加工件最大直徑：φ470mm
機器重量：約9000kg
本機器主要用于硅片、砷化鎵片、陶瓷片、石英晶體及其它半導體材料的雙面高精度研磨或拋光，也適用于其它金屬、非金屬、光學玻璃等硬、脆、薄材料的雙面高精度研磨或拋光。 The machine is uniquely designed for double side lapping and polishing a wide variety of surfaces where flatness and ultra precision surface finish is critical. These materials include silicon wafer, GaAs wafer, ceramic wafer, quartz crystal wafer, semiconductor, and other hard and fragile materials. 查看詳情
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